- Expands global customer engagement at Europe’s largest power electronics exhibition, PCIM 2026
- Showcases integrated portfolio from ceramic substrates to silicone materials with Momentive
- Highlights competitiveness of high-performance materials for power semiconductors across EVs and AI data centers
KCC (CEO: Jung Jae Hun) participated in PCIM Expo & Conference 2026, Europe’s largest power semiconductor exhibition, where it showcased its advanced materials technologies and strengthened its global market outreach.
Held from June 9 to 11 (local time) in Nuremberg, Germany, PCIM 2026 saw KCC showcase its core power semiconductor materials, including ceramic substrates, EMC (Epoxy Molding Compounds), and thermal conductive silicone materials, and actively engage in technical discussions with global customers and industry stakeholders.
In particular, KCC expanded the application scope of its power semiconductor materials beyond electric vehicles (E-mobility) to include AI data centers, highlighting its capabilities in addressing emerging demand driven by the rapid growth of AI infrastructure.
PCIM is Europe’s leading trade fair for power electronics, intelligent motion, renewable energy, and energy management, bringing together global companies, research institutes, and industry experts to showcase the latest technologies and solutions in power semiconductors and related fields.
At this year’s exhibition, KCC was joined by its subsidiary Momentive, a global leader in silicone materials. The two companies jointly presented an integrated portfolio covering ceramic substrates, EMC, and silicone materials for power semiconductors and power modules, attracting strong interest from global customers.
As a key exhibit, KCC introduced its high-reliability AMB (Active Metal Brazing) ceramic substrates. These products enhance bonding strength between copper circuitry and ceramic materials, delivering superior thermal conductivity and mechanical strength. They are widely regarded as optimized solutions for EV inverters and high-power modules.
KCC also presented its DCB (Direct Copper Bonding) substrates, suitable for industrial power modules, alongside a broad range of ceramic substrate products. In addition, the company showcased its high thermal resistance epoxy molding compounds (High Tg EMC) and newly introduced LMC (Liquid Molding Compound), further expanding its power semiconductor packaging materials portfolio.
Momentive exhibited a wide range of high-performance silicone materials applicable across power semiconductors and the electric vehicle industry, including silicone gels for power modules. In particular, its silicone solutions-offering thermal management, insulation, and protection functions-attracted significant attention from customers.
Through the exhibition, KCC also expanded its global customer network. Representatives from major semiconductor and automotive electronics companies visited the KCC booth to explore its power semiconductor material technologies, leading to active discussions on potential applications and technical collaboration. The integrated total solution capability of KCC and Momentive-covering ceramic substrates, EMC, and silicone materials-was recognized as a key differentiator, further strengthening expectations for global market expansion.
A KCC representative stated, “PCIM 2026 provided an important opportunity to effectively present KCC’s power semiconductor material technologies together with Momentive’s silicone solutions to global customers. We will continue to expand our material offerings in line with growing demand for high-performance power semiconductor solutions driven by electric vehicles and AI data centers.”
