SK hynix has been recognized by global foundry leader TSMC with the 2025 Open Innovation Platform (OIP) “Partner of the Year” award, underscoring the company’s key role in advancing AI-focused semiconductor collaborations. TSMC highlighted the contributions of partners who have been instrumental in promoting AI technology development worldwide.
According to TSMC’s October 2 announcement, SK hynix joins a distinguished group of winners including Alphawave Semi, Amazon Web Services (AWS), Arm, Cadence, Microsoft, and Synopsys. The OIP Partner Award is presented annually at TSMC’s OIP Ecosystem Forum to companies that provide innovative solutions across chip design, electronic design automation (EDA), IP integration, and cloud computing, helping to accelerate AI adoption. TSMC emphasized that AI advancement is achieved through strong collaboration rather than individual efforts, positioning this award as recognition of critical ecosystem contributions.
The partnership between SK hynix and TSMC is primarily focused on next-generation high-bandwidth memory (HBM) development and production. SK hynix manufactures HBM modules while TSMC provides advanced packaging technologies that connect HBM with logic chips. Together, the companies are jointly developing optimized packaging solutions that integrate HBM and logic chips, a process essential for maximizing the performance of high-performance computing (HPC) systems such as AI accelerators.
Through these strategic collaborative efforts, SK hynix and TSMC aim to significantly improve AI chip performance and power efficiency, reinforcing their leadership in the global AI semiconductor ecosystem.
